H.E.C. SO15PA-3 5-Slots Backplane Board

The H.E.C. SO15PA-3 is a compact 5-slot backplane board designed for industrial and embedded applications. It supports passive interconnection between CPU and peripheral boards via a standardized backplane interface, providing stable performance, reliable mechanical structure, and scalability for PICMG 1.3 systems. Dimensions: 264 mm x 132 mm (10.4" x 5.2") Form Factor: PICMG 1.3 (SHB Express) Slots: 1x PICMG 1.3 system host board (SHB) slot, 4x PCIe x4 or x1 slots Expansion Support: 2x PCI 32-bit/33MHz slots Power Input: ATX power connector Backplane Type: Passive PCB Thickness: 2.0 mm Operating Temperature: 0°C to 60°C Storage Temperature: -20°C to 85°C Relative Humidity: 10% to 90%, non-condensing Construction: High-quality FR4 PCB, gold finger edge connectors Mounting: Suitable for rackmount or industrial chassis with compatible dimensions Compliance: RoHS compliant Please review pictures carefully and let us know if you have any questions!